He received the bachelor’s (1988) and master’s (1990) degrees and doctor (1993) of Engineering from Waseda University, Japan. After working as a research associate at Tokyo Metropolitan University (1993-1999), he joined Department of Electrical Engineering, Shibaura Institute of Technology (SIT) in Tokyo.
At SIT, he served as the director of Center for Flexible Micromachining (2006-2010) and has been the director of the Center for Flexible System Integration, since 2011. Currently, he is the director of SIT Research Laboratories. He is a member of The Japan Society of Applied Physics (JSAP), Institute of The Electrical Engineers of Japan (IEEJ), The Japan Institute of Electronics Packaging (JIEP).
The focus of his work has been fundamental and practical studies of dielectrics and its interface with semiconductors for optical and electronic applications, including the properties of micro/nano structures and point defects in dielectrics and their interaction with high energy beams such as photons and charged particles. He is the author or coauthor of 73 refereed research papers and is currently working on ion beam applications, especially proton beam writing (PBW) using MeV protons on dielectrics for micro/nano-fabrication. He has developed a dedicated proton beam writer at SIT in collaboration with Japan Atomic Energy Institute and KOBE Steel Corp. His current research interests include the surface modification and 3D deep micromachining of materials by PBW aiming at optical and electronic applications
Dielectrics, Photon, Ion beam, Proton Beam Writing, Micro/nano fabrication, Surface modification, 3D micromachining
- R Kataoka, H Tokita, S Uchida, R Sano and H Nishikawa, ”Frequency dependence and assembly characteristics of silver nanomaterials trapped by dielectrophoresis”, Journal of Physics: Conference Series 646 (2015) 012005
- W. Kada, K. Miura, H. Kato, R. Saruya, A. Kubota, T. Satoh, M. Koka, Y. Ishii, T. Kamiya, H. Nishikawa, O. Hanaizumi, ”Development of embedded Mach?Zehnder optical waveguide structures in polydimethylsiloxane thin films by proton beam writing”, Nucl. Instr. Meth. Phys. Res. B 348, Pages 218-222 (April 2015）
- H. Kato, J. Takahashi, H. Nishikawa, “Fabrication of polydimethylsiloxane microlens arrays on a plastic film by proton beam writing”, J. Vac. Sci. Technol. B 32, 06F506 (2014); http://dx.doi.org/10.1116/1.4900419.
- H. Nishikawa and T. Hozumi, “Application of proton beam writing for the direct etching of polytetrafluoroethylene for polydimethylsiloxane replica molding”, J. Vac. Sci. Technol. B 31, 06F403 (2013); http://dx.doi.org/10.1116/1.4821650.
- K. Saito et al., “Fabrication of curved PDMS microstructures on silica glass by proton beam writing aimed for micro-lens arrays on transparent substrates”, Nucl. Instr. Meth. Phys. Res. B 306, pp.284-287 (July, 2013).
- Y. Arai et al., “Control of Refractive Index of Fluorinated Polyimide by Proton Beam Irradiation”, Jpn. J. Appl. Phys. 52, 012601 (5 pages) (2013).
- S. Uchida et al., “Optical counting of trapped bacteria in dielectrophoretic microdevice with pillar array”, Intelligent Automation and Soft Computing, Vol.18, No.2, pp.165-176 (2012).
- K. Takano et al., “Microprocessing of Arched Bridge Structures with Epoxy Resin by Proton Beam Writing”, J. Photopolymer Sci. Technol., 25, 1, pp.43 - 46 (2012).
- K. Takano et al., “Fabrication of Concave and Convex Structure Array Consisted of Epoxy Long-Nanowires by Light and Heavy Ion Beams Lithography”, Trans. Mat. Res. Soc. Japan, 37, 2, pp. 237 - 240 (2012).
- Y. Maeyoshi et al., “Fabrication of Poly(9,90-dioctylfluorene)-Based Nano- and Microstructures by Proton Beam Writing”, Jpn. J. Appl. Phys., 51, pp.045201/1-4 (2012).
- Y. Tanabe et al., “Electroforming of Ni mold for imprint lithography using high-aspect-ratio PMMA microstructures fabricated by proton beam writing”, Microelectron. Eng., 88, pp.2145-2148 (2011).
- R. Tsuchiya and H. Nishikawa, “Fabrication of silica-based three-dimensional structures by changing fluence using proton beam writing”, Trans. Mat. Res. Soc. Japan, 36 , pp.325-328 (2011) .
International / Domestic Societies
Member of Institute of Electrical Engineers of Japan (IEEJ), Japan Society of Applied Physics, Japan Institute of Electronics Packaging.